Invention Grant
- Patent Title: Semiconductor device including interface layer and method of fabricating thereof
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Application No.: US16443016Application Date: 2019-06-17
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Publication No.: US10971402B2Publication Date: 2021-04-06
- Inventor: Chung-Liang Cheng , I-Ming Chang , Hsiang-Pi Chang , Yu-Wei Lu , Ziwei Fang , Huang-Lin Chao
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L27/088 ; H01L29/10 ; H01L21/02

Abstract:
A method includes providing a channel region and growing an oxide layer on the channel region. Growing the oxide layer includes introducing a first source gas providing oxygen and introducing a second source gas providing hydrogen. The second source gas being different than the first source gas. The growing the oxide layer is grown by bonding the oxygen to a semiconductor element of the channel region to form the oxide layer and bonding the hydrogen to the semiconductor element of the channel region to form a semiconductor hydride byproduct. A gate dielectric layer and electrode can be formed over the oxide layer.
Information query
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