发明授权
- 专利标题: Chip antenna module
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申请号: US16454605申请日: 2019-06-27
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公开(公告)号: US10971821B2公开(公告)日: 2021-04-06
- 发明人: Seong Hee Choi , Sang Jong Lee
- 申请人: Samsung Electro-Mechanics CO., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electro-Mechanics CO., Ltd.
- 当前专利权人: Samsung Electro-Mechanics CO., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: NSIP Law
- 优先权: KR10-2018-0129102 20181026
- 主分类号: H01Q1/22
- IPC分类号: H01Q1/22 ; H01Q1/38 ; H01Q9/04 ; H01Q1/48 ; H01Q1/24
摘要:
A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.
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