A CPE device may include a plurality of CPE modules implemented in hardware. The plurality of CPE modules may include a first module and a second module. The first module and the second module may be arrangeable in a stacked configuration. The first module may include a first interconnection interface component disposed on a top surface of the first module. The second module may include a second interconnection interface component disposed on a bottom surface of the second module. The second interconnection interface component may be configured to complementarily couple to the first interconnection interface component when the first module and the second module are arranged in the stacked configuration.