The present disclosure provides a power module including a circuit board, a first heat-generating component and a second heat-generating component. The circuit board includes a first side and a second side opposite to each other and includes a first plane and second plane disposed on the first side. A first height difference is formed between the first plane and the second plane. The first heat-generating component and the second heat-generating component are disposed on the first plane and the second plane, respectively. The first heat-generating component and the second heat-generating component include a first contact surface and a second contact surface, respectively. The first contact surface and the second contact surface are located at a first collaborative plane of the power module. It benefits to reduce the design complexity of a heat sink, and enhance the heat dissipation capability and the overall power density of the power module simultaneously.