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公开(公告)号：US20220352826A1
公开(公告)日：2022-11-03
申请号：US17727071
申请日：2022-04-22
Applicant: Delta Electronics, Inc.
Inventor： Yang Leng , Zhongwang Yang , Yankai Liu , Wenhua Li , Wei Tang
IPC: H02M3/335 , H01F27/255 , H01F27/30 , H05K1/18
Abstract: The present disclosure provides a power converter including a first capacitor, a second capacitor, and a power module. The first capacitor and the second capacitor are connected in series. The power module is electrically connected to the first capacitor and the second capacitor and includes a circuit board, an absorption capacitor, a primary switch circuit, a magnetic component, and a secondary circuit. The absorption capacitor, the primary switch circuit, the magnetic component and the secondary circuit are disposed on the circuit board. A primary winding and a secondary winding of the magnetic component are electrically connected to the primary switch circuit and the secondary circuit respectively.
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公开(公告)号：US10601325B2
公开(公告)日：2020-03-24
申请号：US16001956
申请日：2018-06-07
Applicant: Delta Electronics, Inc.
Inventor： Shengli Lu , Yanbing Xia , Wenhua Li
Abstract: The present application discloses a DC-to-DC converter circuit and a circuit board layout structure for the same. The DC-to-DC converter circuit is electrically connected between a first power supply side and a second power supply side, and comprises a first branch with a primary side coupled to the first power supply side and a secondary side coupled to the second power supply side; a second branch with a primary side coupled to the first power supply side and a secondary side coupled to the second power supply side; and a first inductor. The secondary sides of the first branch and the second branch are connected in series via the first inductor.
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公开(公告)号：US11553616B2
公开(公告)日：2023-01-10
申请号：US17195320
申请日：2021-03-08
Applicant: Delta Electronics, Inc.
Inventor： Wenhua Li , Xueliang Chang , Yahong Xiong , Qinghua Su
IPC: H05K7/20 , H05K7/02 , H01L23/532 , H02M3/155 , H01L23/31 , H01L23/367
Abstract: The present disclosure provides a module including a circuit board, a first component and a second component. The circuit board includes a first side and a second side opposite to each other and includes a first plane and second plane disposed on the first side. A first height difference is formed between the first plane and the second plane. The first component and the second component are disposed on the first plane and the second plane, respectively. The first component and the second component include a first contact surface and a second contact surface, respectively. The first contact surface and the second contact surface are coplanar with a first surface of the module. It benefits to reduce the design complexity of a heat-transfer component, and enhance the heat dissipation capability and the overall power density of the module simultaneously.
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公开(公告)号：US20200187380A1
公开(公告)日：2020-06-11
申请号：US16690444
申请日：2019-11-21
Applicant: Delta Electronics, Inc.
Inventor： Wenhua Li , Xueliang Chang , Yahong Xiong , Qinghua Su
Abstract: The present disclosure provides a power module including a circuit board, a first heat-generating component and a second heat-generating component. The circuit board includes a first side and a second side opposite to each other and includes a first plane and second plane disposed on the first side. A first height difference is formed between the first plane and the second plane. The first heat-generating component and the second heat-generating component are disposed on the first plane and the second plane, respectively. The first heat-generating component and the second heat-generating component include a first contact surface and a second contact surface, respectively. The first contact surface and the second contact surface are located at a first collaborative plane of the power module. It benefits to reduce the design complexity of a heat sink, and enhance the heat dissipation capability and the overall power density of the power module simultaneously.
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Patent Agency Ranking
公开(公告)号：US20210195779A1
公开(公告)日：2021-06-24
申请号：US17195320
申请日：2021-03-08
Applicant: Delta Electronics, Inc.
Inventor： Wenhua Li , Xueliang Chang , Yahong Xiong , Qinghua Su
IPC: H05K7/02 , H01L23/532 , H01L23/367 , H01L23/31 , H05K7/20 , H02M3/155
Abstract: The present disclosure provides a module including a circuit board, a first component and a second component. The circuit board includes a first side and a second side opposite to each other and includes a first plane and second plane disposed on the first side. A first height difference is formed between the first plane and the second plane. The first component and the second component are disposed on the first plane and the second plane, respectively. The first component and the second component include a first contact surface and a second contact surface, respectively. The first contact surface and the second contact surface are coplanar with a first surface of the module. It benefits to reduce the design complexity of a heat-transfer component, and enhance the heat dissipation capability and the overall power density of the module simultaneously.
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公开(公告)号：US10973153B2
公开(公告)日：2021-04-06
申请号：US16690444
申请日：2019-11-21
Applicant: Delta Electronics, Inc.
Inventor： Wenhua Li , Xueliang Chang , Yahong Xiong , Qinghua Su
Abstract: The present disclosure provides a power module including a circuit board, a first heat-generating component and a second heat-generating component. The circuit board includes a first side and a second side opposite to each other and includes a first plane and second plane disposed on the first side. A first height difference is formed between the first plane and the second plane. The first heat-generating component and the second heat-generating component are disposed on the first plane and the second plane, respectively. The first heat-generating component and the second heat-generating component include a first contact surface and a second contact surface, respectively. The first contact surface and the second contact surface are located at a first collaborative plane of the power module. It benefits to reduce the design complexity of a heat sink, and enhance the heat dissipation capability and the overall power density of the power module simultaneously.
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公开(公告)号：US12136884B2
公开(公告)日：2024-11-05
申请号：US17727071
申请日：2022-04-22
Applicant: Delta Electronics, Inc.
Inventor： Yang Leng , Zhongwang Yang , Yankai Liu , Wenhua Li , Wei Tang
IPC: H02M3/335 , H01F27/255 , H01F27/30 , H05K1/18
Abstract: The present disclosure provides a power converter including a first capacitor, a second capacitor, and a power module. The first capacitor and the second capacitor are connected in series. The power module is electrically connected to the first capacitor and the second capacitor and includes a circuit board, an absorption capacitor, a primary switch circuit, a magnetic component, and a secondary circuit. The absorption capacitor, the primary switch circuit, the magnetic component and the secondary circuit are disposed on the circuit board. A primary winding and a secondary winding of the magnetic component are electrically connected to the primary switch circuit and the secondary circuit respectively.
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公开(公告)号：US20220208430A1
公开(公告)日：2022-06-30
申请号：US17529173
申请日：2021-11-17
Applicant: Delta Electronics, Inc.
Inventor： Quansong Luo , Xi Liu , Xueliang Chang , Zhengyu Ye , Wenhua Li
Abstract: The present disclosure provides a power module and a manufacturing method thereof. The power module includes a substrate, an electronic component, a magnetic component and an encapsulation layer. The substrate includes a first surface and a second surface opposite to each other, and a working region. The working region is disposed on the first surface or the second surface. The electronic component is disposed on the substrate. The magnetic component is disposed on the working region and includes a lateral periphery. The encapsulation layer is disposed on the substrate, covers the electronic component and at least partially surrounds the lateral periphery of the magnetic component. A projection of the encapsulation layer on the first surface of the substrate is not overlapped with a projection of the working region on the first surface, and a gap is formed between the encapsulation layer and the lateral periphery of the magnetic component.
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公开(公告)号：US11121627B2
公开(公告)日：2021-09-14
申请号：US16745402
申请日：2020-01-17
Applicant: Delta Electronics, Inc.
Inventor： Shengli Lu , Wenhua Li
Abstract: The present disclosure relates to a DC/DC conversion system, including a plurality of switch conversion branches, each of the switch conversion branches includes: a primary side circuit, having an input end connected in parallel with an input capacitor; a transformer, having a primary winding coupled to the primary side circuit; and a secondary side circuit, coupled to a secondary winding of the transformer, wherein, input ends of the primary side circuits of the plurality of switch conversion branches are connected in series to form a system input end, output ends of the secondary side circuits of the plurality of switch conversion branches are connected in series to form a system output end, and a filter circuit is connected in parallel with the system output end.
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