Invention Grant
- Patent Title: Adhesive for endoscope, cured product, endoscope, and method for producing endoscope
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Application No.: US16802130Application Date: 2020-02-26
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Publication No.: US10973392B2Publication Date: 2021-04-13
- Inventor: Kazushi Furukawa , Toshihide Yoshitani , Yoshihiro Nakai
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2017-165918 20170830
- Main IPC: A61B1/00
- IPC: A61B1/00 ; C09J163/00

Abstract:
Provided are an adhesive for an endoscope, a cured product, an endoscope, and a method for producing an endoscope. The adhesive for an endoscope is a two-component adhesive for an endoscope. The two-component adhesive has a base and a curing agent. The base includes at least one epoxy resin (A) selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins. The curing agent includes a tertiary amine compound (B). The tertiary amine compound (B) accounts for 60 mass % or more of a curing component included in the curing agent.
Information query