Invention Grant
- Patent Title: Solvent composition, cleaning method, method of forming a coating film, heat transfer fluid, and heat cycle system
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Application No.: US16691991Application Date: 2019-11-22
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Publication No.: US10975008B2Publication Date: 2021-04-13
- Inventor: Masahiko Nakamura , Hiroaki Mitsuoka , Mari Ichinokawa , Atsushi Fujimori , Hidekazu Okamoto
- Applicant: AGC Inc.
- Applicant Address: JP Chiyoda-ku
- Assignee: AGC Inc.
- Current Assignee: AGC Inc.
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2015-148070 20150727,JPJP2016-005952 20160115
- Main IPC: C07C21/18
- IPC: C07C21/18 ; C09D201/00 ; C09K5/04 ; C11D7/50 ; C11D11/00 ; C09D7/20 ; C07C21/22 ; C09K5/10 ; C11D3/43 ; C07C19/10 ; C08K5/02

Abstract:
There are provided: a solvent composition which is excellent in solubility of various organic substances and excellent in detergency, and has no adverse effect on a global environment, is excellent in stability, and is capable of suppressing corrosion of metal; a cleaning method using the solvent composition; a method of forming a coating film; a heat transfer fluid including the solvent composition; and a heat cycle system using the heat transfer fluid. A solvent composition including HCFO-1233yd and HCFC-244ca, in which a content of HCFC-244ca to a total of HCFO-1233yd and HCFC-244ca is 0.0001 to 1 mass %, a cleaning method of contacting the solvent composition with an article, a method of forming a coating film consisting of the nonvolatile organic compound using the solvent composition and a nonvolatile organic compound, a heat transfer fluid including the solvent composition, and a heat cycle system using the heat transfer fluid.
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