- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US16403393Application Date: 2019-05-03
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Publication No.: US10978312B2Publication Date: 2021-04-13
- Inventor: You-Lung Yen , Bernd Karl Appelt , Kay Stefan Essig
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/495 ; H01L23/552 ; H01L21/56 ; H01Q1/22 ; H01Q1/52 ; H01L25/18 ; H01L25/04 ; H01L25/16
Abstract:
At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a carrier having a first surface and a second surface opposite to the first surface, an encapsulant, and an antenna. The encapsulant is disposed on the first surface of the carrier. The antenna is disposed on the encapsulant. The antenna includes a seed layer and a conductive layer.
Public/Granted literature
- US20200350180A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-11-05
Information query
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