Invention Grant
- Patent Title: Multi-layered printed circuit board
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Application No.: US16076337Application Date: 2017-01-17
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Publication No.: US10980136B2Publication Date: 2021-04-13
- Inventor: Adilson Arthur Mohr , Roberto Pereira Silveira
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: Fabian VanCott
- International Application: PCT/US2017/013751 WO 20170117
- International Announcement: WO2018/136036 WO 20180726
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K3/46 ; B41M3/00 ; H05K3/12 ; H05K1/03 ; H05K3/40

Abstract:
A method of forming a multi-layered printed circuit board (PCB) may include, with a printing device, delivering a flexible medium to at least one fluid jet printhead. Printing an electrically conductive fluid on the flexible medium may be performed with at least one fluid jet printhead, to form a first conductive layer on the flexible medium. With the at least one fluid jet printhead, an electrically insulating fluid may be printed on the first conductive layer to form at least one insulating layer on the first conductive layer. With the at least one fluid jet printhead, the electrically conductive fluid may be printed on the at least one insulating layer to form a second conductive layer.
Public/Granted literature
- US20190045639A1 MULTI-LAYERED PRINTED CIRCUIT BOARD Public/Granted day:2019-02-07
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