Multi-layered printed circuit board

    公开(公告)号:US10980136B2

    公开(公告)日:2021-04-13

    申请号:US16076337

    申请日:2017-01-17

    Abstract: A method of forming a multi-layered printed circuit board (PCB) may include, with a printing device, delivering a flexible medium to at least one fluid jet printhead. Printing an electrically conductive fluid on the flexible medium may be performed with at least one fluid jet printhead, to form a first conductive layer on the flexible medium. With the at least one fluid jet printhead, an electrically insulating fluid may be printed on the first conductive layer to form at least one insulating layer on the first conductive layer. With the at least one fluid jet printhead, the electrically conductive fluid may be printed on the at least one insulating layer to form a second conductive layer.

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