发明授权
- 专利标题: Electronic device
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申请号: US16566279申请日: 2019-09-10
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公开(公告)号: US10980150B2公开(公告)日: 2021-04-13
- 发明人: Hiroki Chitaka
- 申请人: DENSO CORPORATION
- 申请人地址: JP Kariya
- 专利权人: DENSO CORPORATION
- 当前专利权人: DENSO CORPORATION
- 当前专利权人地址: JP Kariya
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: JPJP2017-081539 20170417
- 主分类号: H05K5/03
- IPC分类号: H05K5/03 ; H05K7/14 ; H05K7/20 ; B60R16/023
摘要:
A component mounting part has a width shorter than a distance between guiderails. Backside projected parts protrude in a width direction from the component mounting part at a case-backside end. A width K2 which is a sum of a width of the component mounting part and widths of the backside projected parts is greater than a distance G1 between the guiderails. A clearance is formed between the circuit board and the heat conduction member when the backside projected parts are supported by the guiderails. A distance G3 from an insertion slot to an end of the guiderail on the case backside, is shorter than a distance K4 from an end of the circuit board on the side of the insertion slot to an end of the backside projected part on the side of the insertion slot.
公开/授权文献
- US20200008319A1 ELECTRONIC DEVICE 公开/授权日:2020-01-02
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