Invention Grant
- Patent Title: Kinetically limited nano-scale diffusion bond structures and methods
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Application No.: US16156760Application Date: 2018-10-10
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Publication No.: US10981355B2Publication Date: 2021-04-20
- Inventor: Michael S. Sandlin , David A. Ruben , Raymond M. Karam , Georges Roussos , Thomas M. Wynne
- Applicant: Medtronic, Inc. , Corning Incorporated
- Applicant Address: US MN Minneapolis; US NY Corning
- Assignee: Medtronic, Inc.,Corning Incorporated
- Current Assignee: Medtronic, Inc.,Corning Incorporated
- Current Assignee Address: US MN Minneapolis; US NY Corning
- Agency: Patterson Thuente Pedersen, P.A.
- Main IPC: B32B7/04
- IPC: B32B7/04 ; B23K20/02 ; B32B15/04 ; B23K20/22 ; B32B37/14 ; B32B17/06 ; B23K103/14 ; B23K103/18 ; B23K103/00 ; B23K103/16
Abstract:
Bulk materials having a kinetically limited nano-scale diffusion bond is provided. The bulk materials having a kinetically limited nano-scale diffusion bond includes transparent material, absorbent opaque material and a diffusion bond. The transparent material has properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption. The absorbent opaque material has properties that significantly absorb energy from the electromagnetic beam. The diffusion bond is formed by the electromagnetic beam bonding the transparent material to the absorbent opaque material. Moreover, the diffusion bond has a thickness that is less than 1000 nm.
Public/Granted literature
- US20190039347A1 KINETICALLY LIMITED NANO-SCALE DIFFUSION BOND STRUCTURES AND METHODS Public/Granted day:2019-02-07
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