Invention Grant
- Patent Title: High electron mobility transistor with improved barrier layer
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Application No.: US16411053Application Date: 2019-05-13
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Publication No.: US10985271B2Publication Date: 2021-04-20
- Inventor: Po-Yu Yang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN201910298721.8 20190415
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L21/02 ; H01L29/205 ; H01L29/40 ; H01L29/417 ; H01L29/423 ; H01L29/66

Abstract:
A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a first barrier layer on the buffer layer; forming a patterned mask on the first barrier layer; forming a second barrier layer adjacent to two sides of the patterned mask; removing the patterned mask to form a recess; forming a gate electrode in the recess; and forming a source electrode and a drain electrode adjacent to two sides of the gate electrode.
Public/Granted literature
- US20200328298A1 HIGH ELECTRON MOBILITY TRANSISTOR Public/Granted day:2020-10-15
Information query
IPC分类: