An integrated power electronics component configured for mitigating noise, vibration, and harshness includes a case formed from metal and configured to dampen a sound wave having a first frequency and a first amplitude and propagatable in a first direction. The case has a first surface and a second surface spaced apart from the first surface, a first stiffness, and a first strength, and the first and second surfaces include a structure defining a plurality of recessions therein. The component includes a cured polymer formed from a composition disposed on at least one of the first and second surfaces in each of the recessions to thereby dampen the sound wave in the first direction and in a second direction that is perpendicular to the first direction to a second frequency that is less than the first frequency and a second amplitude that is less than the first amplitude.