Invention Grant
- Patent Title: Implantable medical devices and related connector enclosure assemblies utilizing conductors electrically coupled to feedthrough pins
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Application No.: US16247950Application Date: 2019-01-15
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Publication No.: US10987519B2Publication Date: 2021-04-27
- Inventor: Steven T. Deininger , Michael J. Baade , Rajesh V. Iyer
- Applicant: MEDTRONIC, INC.
- Applicant Address: US MN Minneapolis
- Assignee: MEDTRONIC, INC.
- Current Assignee: MEDTRONIC, INC.
- Current Assignee Address: US MN Minneapolis
- Agency: Withers & Keys, LLC
- Main IPC: A61N1/37
- IPC: A61N1/37 ; A61N1/375 ; H05K7/02 ; H05K7/14 ; H01R13/52 ; H01R43/26 ; H01G4/35 ; H01R4/02 ; H01R13/516 ; H01R24/58 ; H01R107/00

Abstract:
Implantable medical devices include connector enclosure assemblies that utilize conductors that are electrically coupled to feedthrough pins and that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.
Public/Granted literature
Information query
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