- Patent Title: Photonic integrated circuit package and method of forming the same
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Application No.: US16642336Application Date: 2018-09-03
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Publication No.: US10989887B2Publication Date: 2021-04-27
- Inventor: Teck Guan Lim , Surya Bhattacharya
- Applicant: Agency for Science, Technology and Research
- Applicant Address: SG Singapore
- Assignee: Agency for Science, Technology and Research
- Current Assignee: Agency for Science, Technology and Research
- Current Assignee Address: SG Singapore
- Agency: Winstead PC
- Priority: SG10201707236R 20170906
- International Application: PCT/SG2018/050445 WO 20180903
- International Announcement: WO2019/050477 WO 20190314
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/42 ; H01L23/00 ; H01L25/16

Abstract:
Various embodiments may relate to a method of forming a photonic integrated circuit package (PIC). The method may include forming a redistribution layer (RDL) over a carrier. The method may also include forming a through hole or cavity on the redistribution layer. The method may additionally include providing a stop-ring structure, the stop-ring structure including a ring of suitable material, the stop-ring structure defining a hollow space, over the redistribution layer so that the hollow space is over the through hole or cavity. The method may further include arranging a photonic integrated circuit (PIC) die over the redistribution layer so that the photonic integrated circuit (PIC) die is on the stop-ring structure. The method may also include forming a molded package by forming a mold structure to at least partially cover the photonic integrated circuit (PIC) die to form the photonic integrated circuit package.
Public/Granted literature
- US20200310052A1 PHOTONIC INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME Public/Granted day:2020-10-01
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