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公开(公告)号：US20200350363A1
公开(公告)日：2020-11-05
申请号：US16962187
申请日：2019-01-28
Applicant: Agency for Science, Technology and Research
Inventor： Teck Guan Lim , Hideaki Fukuzawa , Hang Liu
IPC: H01L27/22 , H01L23/498 , H01L43/02 , H01L23/00
Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a substrate including a via hole. The semiconductor package may also include a chip attached to the substrate. The semiconductor package may further include a prefabricated ferromagnetic pin having a first portion held by the via hole, a second portion extending from a first end of the first portion, and a third portion extending from a second end of the first portion opposite the first end. The semiconductor package may also include a first magnetic shield structure attached to or extended from the second portion of the prefabricated ferromagnetic pin. The semiconductor package may further include a second magnetic shield structure attached to or extended from the third portion of the prefabricated ferromagnetic pin, such that at least a portion of the chip is between the first magnetic shield structure and the second magnetic shield structure.
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Patent Agency Ranking
公开(公告)号：US20210109302A1
公开(公告)日：2021-04-15
申请号：US16498891
申请日：2018-03-28
Applicant: Agency for Science, Technology and Research
Inventor： Teck Guan Lim
IPC: G02B6/42
Abstract: Various embodiments may provide an optical assembly. The optical assembly may include a substrate with a first and a second grooves, and a photonic integrated circuit chip with a coupling waveguide, a first and a second grooves. The optical assembly may further include a first and a second cylindrical rods held by the respective grooves of the substrate and the photonic integrated circuit chip. A portion of the first rod and a portion of the second rod define a vertical offset between the photonic integrated circuit chip and the substrate to align the coupling waveguide with an optical fiber.
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公开(公告)号：US20200310052A1
公开(公告)日：2020-10-01
申请号：US16642336
申请日：2018-09-03
Applicant: Agency for Science, Technology and Research
Inventor： Teck Guan Lim , Surya Bhattacharya
Abstract: Various embodiments may relate to a method of forming a photonic integrated circuit package (PIC). The method may include forming a redistribution layer (RDL) over a carrier. The method may also include forming a through hole or cavity on the redistribution layer. The method may additionally include providing a stop-ring structure, the stop-ring structure including a ring of suitable material, the stop-ring structure defining a hollow space, over the redistribution layer so that the hollow space is over the through hole or cavity. The method may further include arranging a photonic integrated circuit (PIC) die over the redistribution layer so that the photonic integrated circuit (PIC) die is on the stop-ring structure. The method may also include forming a molded package by forming a mold structure to at least partially cover the photonic integrated circuit (PIC) die to form the photonic integrated circuit package.
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公开(公告)号：US11177318B2
公开(公告)日：2021-11-16
申请号：US16962187
申请日：2019-01-28
Applicant: Agency for Science, Technology and Research
Inventor： Teck Guan Lim , Hideaki Fukuzawa , Hang Liu
IPC: H01L27/22 , H01L23/498 , H01L23/00 , H01L43/02
Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a substrate including a via hole. The semiconductor package may also include a chip attached to the substrate. The semiconductor package may further include a prefabricated ferromagnetic pin having a first portion held by the via hole, a second portion extending from a first end of the first portion, and a third portion extending from a second end of the first portion opposite the first end. The semiconductor package may also include a first magnetic shield structure attached to or extended from the second portion of the prefabricated ferromagnetic pin. The semiconductor package may further include a second magnetic shield structure attached to or extended from the third portion of the prefabricated ferromagnetic pin, such that at least a portion of the chip is between the first magnetic shield structure and the second magnetic shield structure.
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公开(公告)号：US10989887B2
公开(公告)日：2021-04-27
申请号：US16642336
申请日：2018-09-03
Applicant: Agency for Science, Technology and Research
Inventor： Teck Guan Lim , Surya Bhattacharya
Abstract: Various embodiments may relate to a method of forming a photonic integrated circuit package (PIC). The method may include forming a redistribution layer (RDL) over a carrier. The method may also include forming a through hole or cavity on the redistribution layer. The method may additionally include providing a stop-ring structure, the stop-ring structure including a ring of suitable material, the stop-ring structure defining a hollow space, over the redistribution layer so that the hollow space is over the through hole or cavity. The method may further include arranging a photonic integrated circuit (PIC) die over the redistribution layer so that the photonic integrated circuit (PIC) die is on the stop-ring structure. The method may also include forming a molded package by forming a mold structure to at least partially cover the photonic integrated circuit (PIC) die to form the photonic integrated circuit package.
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公开(公告)号：US11105989B2
公开(公告)日：2021-08-31
申请号：US16498891
申请日：2018-03-28
Applicant: Agency for Science, Technology and Research
Inventor： Teck Guan Lim
IPC: G02B6/42
Abstract: Various embodiments may provide an optical assembly. The optical assembly may include a substrate with a first and a second grooves, and a photonic integrated circuit chip with a coupling waveguide, a first and a second grooves. The optical assembly may further include a first and a second cylindrical rods held by the respective grooves of the substrate and the photonic integrated circuit chip. A portion of the first rod and a portion of the second rod define a vertical offset between the photonic integrated circuit chip and the substrate to align the coupling waveguide with an optical fiber.
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