Invention Grant
- Patent Title: Touchpad assembly for electronic devices
-
Application No.: US16641563Application Date: 2017-08-31
-
Publication No.: US10990203B2Publication Date: 2021-04-27
- Inventor: Hung-Ming Chen , Chao-Wen Cheng , Kuan-Ting Wu
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Global IP Services PLLC
- International Application: PCT/US2017/049511 WO 20170831
- International Announcement: WO2019/045710 WO 20190307
- Main IPC: G06F3/0354
- IPC: G06F3/0354 ; G06F1/16

Abstract:
In one example, touchpad assembly is disclosed, which may include a bottom cover, a horizontal elastic member flexibly positioned on the bottom cover, a balancing bar disposed on the bottom cover and substantially parallel to the horizontal elastic member, and a metal dome. The metal dome may include a first end fixedly connected to the bottom cover via a first fixture, and a second end to hold the horizontal elastic member and the balancing bar such that the balancing bar is flexibly engaged with the bottom cover. The balancing bar, the metal dome, and the horizontal elastic member may control a flexure of a touchpad when the touchpad is pressed.
Public/Granted literature
- US20200183510A1 TOUCHPAD ASSEMBLY FOR ELECTRONIC DEVICES Public/Granted day:2020-06-11
Information query
IPC分类: