公开(公告)号：US11910538B2

公开(公告)日：2024-02-20

申请号：US17602884

申请日：2019-08-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Yi-Chen Chen ,  Kun Cheng Tsai ,  Kuan-Ting Wu ,  Ying-Hung Ku ,  Hsueh Chen Hung

IPC: H05K3/18 ,  H05K1/09 ,  H05K1/11 ,  H05K3/02 ,  H05K3/40 ,  H05K5/00

CPC classification number: H05K3/181 ,  H05K1/09 ,  H05K1/117 ,  H05K3/027 ,  H05K3/188 ,  H05K3/403 ,  H05K5/0026 ,  H05K2203/0502

Abstract: In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.

公开(公告)号：US11808316B2

公开(公告)日：2023-11-07

申请号：US17852782

申请日：2022-06-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chung-Hua Ku ,  Chi Hao Chang

IPC: F16F1/36 ,  C08K3/04 ,  C08K3/36 ,  C08K5/09 ,  C08K13/02 ,  G11B33/08 ,  H01H13/14 ,  B82Y30/00 ,  B82Y40/00

CPC classification number: F16F1/3605 ,  C08K3/041 ,  C08K3/042 ,  C08K3/36 ,  C08K5/09 ,  C08K13/02 ,  G11B33/08 ,  H01H13/14 ,  B82Y30/00 ,  B82Y40/00 ,  C08K2201/006 ,  C08K2201/011 ,  C08K2201/014 ,  F16F2224/02 ,  F16F2224/025 ,  F16F2226/04 ,  H01H2221/062

Abstract: An electronic device can include a first electronic component, a second electronic component, and an energy dampener positioned between and in contact with the first electronic component and the second electronic component. The energy dampener in this example includes a carbon nanotube-aerogel matrix including carbon nanotubes embedded in an aerogel with a rubber composited therewith.

公开(公告)号：US11762427B2

公开(公告)日：2023-09-19

申请号：US17418464

申请日：2019-02-01

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  Ya-Ting Yeh ,  Chih-Hsiung Liao

IPC: G06F1/16

CPC classification number: G06F1/1656 ,  G06F1/1616

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an aluminum or aluminum alloy cover frame having an opening. A magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening. A protective coating can be over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel. A chamfered edge can include a chamfer at an edge of the aluminum or aluminum alloy cover frame. The chamfer can expose the aluminum or aluminum alloy cover frame beneath the protective coating, and the chamfer at the same time does not expose the magnesium or magnesium alloy cover panel.

公开(公告)号：US20230113973A1

公开(公告)日：2023-04-13

申请号：US17915152

申请日：2021-01-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Shreenath Anandakrishnan ,  Kuan-Ting Wu

IPC: C09D5/00 ,  C09D7/48 ,  C09D175/04 ,  C09D7/61 ,  C09D7/63

Abstract: Herein is described a substrate coated with a thermal management material for an electronic device, wherein the thermal management material comprises: a thermal conductive coat deposited on the substrate; and a heat insulation coat deposited on the thermal conductive coat, wherein the heat insulation coat comprises a plant root powder and a resin. A process for coating the substrate with a thermal management material, and an electronic device having a housing comprising a thermal management material is also described herein.

公开(公告)号：US11502389B2

公开(公告)日：2022-11-15

申请号：US16976495

申请日：2018-04-24

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Ting Lin ,  Chi Hao Chang ,  Kuan-Ting Wu

IPC: H01Q1/22 ,  H01Q1/36 ,  H01Q1/48

Abstract: In example implementations, an enclosure is provided. The enclosure includes a first layer of carbon fiber and a second layer of a carbon fiber pattern fabricated from a plastic. The first layer of carbon fiber is formed in a shape of a portable electronic device. An antenna window is formed in the first layer of the carbon fiber. The second layer of the carbon fiber pattern has a same shape and a same size as the first layer of carbon fiber.

公开(公告)号：US11481479B2

公开(公告)日：2022-10-25

申请号：US16634003

申请日：2017-09-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  Wei-Chung Chen ,  Xuan-Fang Shi

IPC: G06F21/32 ,  G06F21/46 ,  G06F21/60 ,  G06F1/16

Abstract: A system may include a fingerprint scanner and a magnetic switch coupled to the fingerprint scanner. The magnetic switch may couple a lid of a computing device to abase of a computing device. The system may further include an infrared (IR) scanner coupled to the magnetic switch. Additionally, the system may include an electronic switch coupled to the IR scanner.

公开(公告)号：US11475805B2

公开(公告)日：2022-10-18

申请号：US17042383

申请日：2018-09-27

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chi Hao Chang ,  Xuan Shi

IPC: G09F9/37 ,  B81B5/00 ,  G02B26/08

Abstract: In an example, a switchable display may include a movable pixel unit having a rotatable motive element. The movable pixel unit may further include a first display unit having a first display characteristic and disposed on a first side of the rotatable motive element. The movable pixel unit may further include a second display unit having a second display characteristic and disposed on a second side of the rotatable motive unit, different from the first side.

公开(公告)号：US20220167505A1

公开(公告)日：2022-05-26

申请号：US17602884

申请日：2019-08-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Yi-Chen Chen ,  Kun Cheng Tsai ,  Kuan-Ting Wu ,  Ying-Hung Ku ,  Hsueh Chen Hung

IPC: H05K3/18 ,  H05K1/09 ,  H05K3/40 ,  H05K1/11 ,  H05K5/00 ,  H05K3/02

Abstract: In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.

公开(公告)号：US20220137680A1

公开(公告)日：2022-05-05

申请号：US17297146

申请日：2019-07-25

Applicant: Hewlett- Packard Development Company, L.P.

Inventor： Chien-Ting Lin ,  Kuan-Ting Wu ,  Chi Hao Chang

IPC: G06F1/18 ,  B29C63/02 ,  C23C28/02 ,  C25D7/00 ,  C25D3/12 ,  C23C18/16 ,  C23C18/18

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include a substrate having an opening therethrough, or an outer edge, or both. A thermoplastic insert molding can include a metal oxide dopant, the thermoplastic insert molding positioned on the substrate. A paint coating can be included on the thermoplastic insert molding. A chamfered edge can be present on the substrate at a location that defines the opening, the outer edge, or both, wherein the chamfered edge cuts through the paint coating and partially through the thermoplastic insert molding to expose a portion of the metal oxide dopant at the chamfered edge. A metal layer can be formed using laser direct structuring masking a portion of the metal oxide dopant exposed at the chamfered edge. A second metal layer can be formed over the metal layer.

公开(公告)号：US20220119971A1

公开(公告)日：2022-04-21

申请号：US17425146

申请日：2019-05-09

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chi Hao Chang ,  Chienchih Chiu

IPC: C25D1/14 ,  C25D13/20 ,  C25D13/02 ,  H01M50/124

Abstract: In one example, a method for manufacturing an electronic device housing is described. A coating layer may be formed on a surface of a metal substrate. Further, an edge region of the metal substrate may be chamfered by applying water-based anti-corrosion cutting fluid to form an exposed surface portion of the metal substrate. On the exposed surface portion, a transparent protective passivation layer may be formed. Furthermore, a first electrophoretic deposition layer may be formed on the transparent protective passivation layer.