Invention Grant
- Patent Title: Cleaning method and plasma processing apparatus
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Application No.: US16844449Application Date: 2020-04-09
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Publication No.: US10991551B2Publication Date: 2021-04-27
- Inventor: Mohd Fairuz Bin Budiman , Shinya Morikita , Toshifumi Nagaiwa
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JPJP2019-077360 20190415
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H05H1/46

Abstract:
A cleaning method is provided. In the cleaning method, a cleaning gas is supplied into a processing chamber, a radio frequency (RF) power for plasma generation is applied to one of a first electrode on which a substrate is to be mounted and a second electrode disposed to be opposite to the first electrode in the processing chamber, and a negative voltage is applied to an edge ring disposed to surround the substrate. Further, plasma is generated from the cleaning gas and a cleaning process using the plasma is performed.
Public/Granted literature
- US20200328064A1 CLEANING METHOD AND PLASMA PROCESSING APPARATUS Public/Granted day:2020-10-15
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