- Patent Title: Semiconductor package comprising chiplets disposed on a substrate which are electromagnetically coupled by dielectric waveguides and a computing networks formed therefrom
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Application No.: US16192293Application Date: 2018-11-15
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Publication No.: US10992017B2Publication Date: 2021-04-27
- Inventor: Telesphor Kamgaing , Georgios Dogiamis , Aleksandar Aleksov , Gilbert W. Dewey , Hyung-Jin Lee
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H01P5/08
- IPC: H01P5/08 ; H01P3/16 ; H01P1/208 ; H01L23/66 ; H01L25/065 ; H01P5/107 ; H01L23/00
Abstract:
Embodiments may relate to a dielectric waveguide that includes a substrate and a waveguide material disposed within the substrate. The dielectric waveguide may further include a waveguide launcher electromagnetically and physically coupled with the waveguide material, wherein the waveguide launcher is exposed at a side of the dielectric substrate. Other embodiments may be described or claimed.
Public/Granted literature
- US20190089036A1 ON-CHIP WAVEGUIDE NETWORKS Public/Granted day:2019-03-21
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