Invention Grant
- Patent Title: High-speed interface apparatus and deskew method thereof
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Application No.: US17023598Application Date: 2020-09-17
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Publication No.: US10992447B2Publication Date: 2021-04-27
- Inventor: Han Soo Lee , Sung Jun Kim , Chae Ryung Kim , Dong Uk Park , Youn Woong Chung , Jung Myung Choi , Han Kyul Lim , Gyeong Han Cha
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2014-0016905 20140213
- Main IPC: H04L7/00
- IPC: H04L7/00 ; G01R31/317 ; H03K5/131 ; H04L25/14 ; H03K5/00

Abstract:
A high-speed interface apparatus and method of correcting skew in the apparatus are provided. A high-speed transmitter includes a transmission D-PHY module that generates and transmits a clock signal through a clock channel, generates a deskew synchronous code and test data in response to a deskew request signal, transmits the deskew synchronous code followed by the test data through a data channel, and transmits a normal synchronous code followed by normal data through the data channel in normal mode.
Public/Granted literature
- US20210006387A1 HIGH-SPEED INTERFACE APPARATUS AND DESKEW METHOD THEREOF Public/Granted day:2021-01-07
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