Invention Grant
- Patent Title: Securing mechanism for use with processor module
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Application No.: US16700975Application Date: 2019-12-02
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Publication No.: US10993326B2Publication Date: 2021-04-27
- Inventor: Heng-Kang Wu , Fu-Jin Peng
- Applicant: FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD. , FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Applicant Address: CN Shenzhen; KY Grand Cayman
- Assignee: FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD.,FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee: FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD.,FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee Address: CN Shenzhen; KY Grand Cayman
- Agent Ming Chieh Chang; Wei Te Chung
- Priority: CN201822006742.1 20181130
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; H01L23/40 ; H01R13/639 ; H05K5/04 ; H05K3/30

Abstract:
A securing mechanism for retaining a CPU to an electrical connector mounted upon a top surface of the PCB, includes a fastening device mounted upon the top surface of the PCB beside the electrical connector, and a back plate mounted upon the undersurface of the PCB and located between the PCB and a metallic case. The fastening device cooperates with the back plate to be secured to the PCB via a first set of fixing units. The case forms an opening/recessed region to receive a thickened central region of the back plate and is secured to the back plate via a second set of fixing units surrounding said opening. The thickened central region is fully received within the opening in the vertical direction. The first set of fixing units are located in the central region of the back plate.
Public/Granted literature
- US20200178394A1 SECURING MECHANISM FOR USE WITH PROCESSOR MODULE Public/Granted day:2020-06-04
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