Invention Grant
- Patent Title: Assembly system
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Application No.: US16169511Application Date: 2018-10-24
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Publication No.: US10993360B2Publication Date: 2021-04-27
- Inventor: Yingcong Deng , Jaroslaw Kowalski , Andrzej Przybylski , Jaroslaw Grzebski , Dandan Zhang , Lvhai Hu , Fengchun Xie , Yun Liu , Roberto Francisco-Yi Lu , Haidong Wu , Hui Xiao
- Applicant: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Kunshan League Automechanism Co., Ltd. , Tyco Electronics Polska Sp. z.o.o.
- Applicant Address: CN Shanghai; US PA Berwyn; CN Kunshan; PL Warsaw
- Assignee: Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Corporation,Kunshan League Automechanism Co., Ltd.,Tyco Electronics Polska Sp. z.o.o.
- Current Assignee: Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Corporation,Kunshan League Automechanism Co., Ltd.,Tyco Electronics Polska Sp. z.o.o.
- Current Assignee Address: CN Shanghai; US PA Berwyn; CN Kunshan; PL Warsaw
- Agency: Barley Snyder
- Priority: CN201711007567.1 20171025
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04 ; H05K13/08 ; H01R43/20

Abstract:
An assembly system comprises a fixing device configured to fix a housing and a pressing mechanism adapted to assemble a contact into the housing. The pressing mechanism includes a fixing block having a contact guiding slot adapted to receive the contact therein and a movable block movably mounted on the fixing block and adapted to press the contact downward. The movable block is moved downward to press the contact received in the contact guiding slot into a contact installation slot of the housing in a condition in which the contact guiding slot of the fixing block is aligned with the contact installation slot of the housing.
Public/Granted literature
- US20190124805A1 Assembly System And Assembly Method Public/Granted day:2019-04-25
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