A semiconductor memory module includes a memory printed circuit board (PCB) that includes first connectors, a second connector, and a third connector configured to be connectable with an external device, memory devices that are mounted on the memory PCB and are connected with the first connectors, and a power management integrated circuit that is mounted on the memory PCB, receives a first voltage through the second connector, generates a second voltage from the first voltage, and supplies the second voltage to the memory devices. The power management integrated circuit adjusts the second voltage depending on a difference between a signal received through the third connector and the second voltage.