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公开(公告)号：US10998012B2
公开(公告)日：2021-05-04
申请号：US16727066
申请日：2019-12-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yoo-Jeong Kwon , Jinseong Yun , Kyudong Lee
Abstract: A semiconductor memory module includes a memory printed circuit board (PCB) that includes first connectors, a second connector, and a third connector configured to be connectable with an external device, memory devices that are mounted on the memory PCB and are connected with the first connectors, and a power management integrated circuit that is mounted on the memory PCB, receives a first voltage through the second connector, generates a second voltage from the first voltage, and supplies the second voltage to the memory devices. The power management integrated circuit adjusts the second voltage depending on a difference between a signal received through the third connector and the second voltage.
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公开(公告)号：US20200335140A1
公开(公告)日：2020-10-22
申请号：US16727066
申请日：2019-12-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yoo-Jeong Kwon , Jinseong Yun , Kyudong Lee
Abstract: A semiconductor memory module includes a memory printed circuit board (PCB) that includes first connectors, a second connector, and a third connector configured to be connectable with an external device, memory devices that are mounted on the memory PCB and are connected with the first connectors, and a power management integrated circuit that is mounted on the memory PCB, receives a first voltage through the second connector, generates a second voltage from the first voltage, and supplies the second voltage to the memory devices. The power management integrated circuit adjusts the second voltage depending on a difference between a signal received through the third connector and the second voltage.
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