Invention Grant
- Patent Title: High-density switch
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Application No.: US16739226Application Date: 2020-01-10
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Publication No.: US11005223B2Publication Date: 2021-05-11
- Inventor: David N. Warren
- Applicant: HD Networks, LLC
- Applicant Address: US FL Stuart
- Assignee: HD Networks, LLC
- Current Assignee: HD Networks, LLC
- Current Assignee Address: US FL Stuart
- Agency: McHale & Slavin, P.A.
- Main IPC: H01R13/6463
- IPC: H01R13/6463 ; H01R25/00 ; H01R13/717 ; H01R27/02 ; H01R24/64 ; H01R107/00 ; H04Q1/02 ; H01R31/00

Abstract:
Disclosed is a high-density switch for use in a network incorporating high-density connections for increased efficiency, network operation and management. The high-density connections are incorporated into the patch panel, network switch, and cables that connects them, as well as into cable analyzers and printed circuit boards (PCBs) which allow for a complete network within a single computer running virtualization software.
Public/Granted literature
- US20200153179A1 High-density switch Public/Granted day:2020-05-14
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