Invention Grant
- Patent Title: Three-dimensional (3D) printing with epoxy resin
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Application No.: US16073115Application Date: 2016-04-20
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Publication No.: US11007712B2Publication Date: 2021-05-18
- Inventor: Qin Liu , Chien-Hua Chen , Michael G. Monroe , Bruce Cowger
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Dierker & Kavanaugh PC
- International Application: PCT/US2016/028519 WO 20160420
- International Announcement: WO2017/184135 WO 20171026
- Main IPC: B29C64/165
- IPC: B29C64/165 ; B33Y10/00 ; B33Y70/00 ; B29K105/00 ; B29C64/112 ; B29K63/00

Abstract:
In a three-dimensional printing method example, a build material, including an epoxy resin powder, is applied. A hardener liquid is selectively applied on at least a portion of the build material. The portion of the build material in contact with the hardener liquid is allowed to cure to form a layer of a 3D part. In another three-dimensional printing method example, a filler build material is applied. A liquid epoxy resin is selectively applied on at least a portion of the filler. A hardener liquid is selectively applied on the at least the portion of the filler. The portion of the filler in contact with the liquid epoxy resin and the hardener liquid is allowed to cure to form a layer of a 3D part.
Public/Granted literature
- US20190039293A1 THREE-DIMENSIONAL (3D) PRINTING WITH EPOXY RESIN Public/Granted day:2019-02-07
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