- 专利标题: Print module with sliding PCB engagement mechanism
-
申请号: US16591507申请日: 2019-10-02
-
公开(公告)号: US11014364B2公开(公告)日: 2021-05-25
- 发明人: David Burke , Norman Berry , Harrick Selvan Anothonysamy , Reynovel Pacinio Anciano , Soon Keat Fah , Poh Lai Say
- 申请人: MEMJET TECHNOLOGY LIMITED
- 申请人地址: IE Dublin
- 专利权人: MEMJET TECHNOLOGY LIMITED
- 当前专利权人: MEMJET TECHNOLOGY LIMITED
- 当前专利权人地址: IE Dublin
- 代理机构: Cooley LLP
- 主分类号: B41J2/175
- IPC分类号: B41J2/175 ; B41J29/02 ; B41J29/54 ; B41J2/165 ; B41J29/56 ; B41J25/304 ; B41J25/34 ; B41J2/235
摘要:
A print module includes: a cradle having a longitudinal cavity; an elongate printhead assembly positioned in the longitudinal cavity; a supply assembly slidably movable relative to the cradle along an axis perpendicular to a longitudinal axis of the printhead assembly, the supply assembly including a PCB fastened to a PCB mounting plate having a resilient flange configured for clamping engagement with a portion of the PCB containing PCB contacts; and a slide plate slidably movable relative to the cradle along an axis parallel to the longitudinal axis of the printhead assembly. The slide plate is configured for camming engagement with the resilient flange and sliding movement of the slide plate urges the resilient flange into clamping engagement with the portion of the PCB containing PCB contacts, thereby electrically connecting the PCB contacts with the printhead.
信息查询
IPC分类: