- Patent Title: Amide combinations for cleaning and stripping of electronic parts
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Application No.: US16628598Application Date: 2017-07-06
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Publication No.: US11016392B2Publication Date: 2021-05-25
- Inventor: Qi Jiang , Xin Jiang , Hua Ren , Eungkyu Kim , Jianhai Mu , Kaoru Ohba , William J. Harris
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Quarles & Brady LLP
- International Application: PCT/CN2017/091996 WO 20170706
- International Announcement: WO2019/006725 WO 20190110
- Main IPC: C11D7/50
- IPC: C11D7/50 ; G03F7/42 ; C11D7/32
Abstract:
A solvent consisting essentially of: (A) a first component consisting of N,N-diethylacetamide (DEAC); (B) a second component consisting of 3-methoxy-N, N-dimethyl propionamide (M3DMPA); and (C) an optional third component consisting of one or more glycol ethers or glycol ether acetates; or a solvent consisting essentially of: (1) a first component consisting of one or more acyclic amides of Formula (I): and (2) an optional second component consisting of one or more of DEAC, M3DMPA, N,N-dimethylpropionamide, one or more glycol ethers or glycol ether acetates, and one or more cyclic amides of Formulae (II-IV).
Public/Granted literature
- US20200150542A1 Amide Combinations for Cleaning and Stripping of Electronic Parts Public/Granted day:2020-05-14
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