Invention Grant
- Patent Title: Coil component
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Application No.: US16158701Application Date: 2018-10-12
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Publication No.: US11017931B2Publication Date: 2021-05-25
- Inventor: Byung Soo Kang , Yong Hui Li , Byeong Cheol Moon , Yoon Mi Cha , Eun Jin Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0041461 20180410
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F17/00 ; H01F17/04 ; H01F3/10 ; H01F27/29 ; H01F1/14 ; H01F27/02 ; H01F27/255 ; H01F41/04 ; H01F27/36

Abstract:
A coil component includes a body, a coil part embedded in the body, and an insulating layer covering the body. First and second plating electrodes are disposed between the body and the insulating layer, are connected to the coil part, and are disposed to be spaced apart from each other on one surface of the body. First and second through electrodes penetrate through the insulating layer to thereby be connected to the first and second plating electrodes, respectively.
Public/Granted literature
- US20190311829A1 COIL COMPONENT Public/Granted day:2019-10-10
Information query