公开(公告)号：US12170170B2

公开(公告)日：2024-12-17

申请号：US17523198

申请日：2021-11-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jun Hyeong Kim ,  Myung Jun Park ,  Jin Soo Park ,  Yeon Song Kang ,  Eun Jin Kim ,  Kyu Sik Park ,  Kang Ha Lee

IPC: H01G4/232 ,  H01G4/008 ,  H01G4/30

Abstract: A multilayer electronic component, includes: a body including a dielectric layer, and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween; a first connection portion including a first conductive layer disposed on the third surface and connected to the first internal electrode, and a first insulating layer disposed on the first conductive layer; a second connection portion including a second conductive layer disposed on the fourth surface and connected to the second internal electrode, and a second insulating layer disposed on the second conductive layer; a first external electrode including a first electrode layer connected to the first conductive layer, wherein the first external electrode is disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode including a second electrode layer connected to the second conductive layer.

公开(公告)号：US10892101B2

公开(公告)日：2021-01-12

申请号：US16184674

申请日：2018-11-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo Lee ,  Hyun Hee Gu ,  Eui Hyun Jo ,  Jong Ho Lee ,  Eun Jin Kim ,  Hye Young Choi

IPC: H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G4/228

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a first plating portion disposed on the electrode layer and having a thickness ranging from 0.3 μm to 1 μm, and a second plating portion disposed on the first plating portion.

公开(公告)号：US11017931B2

公开(公告)日：2021-05-25

申请号：US16158701

申请日：2018-10-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byung Soo Kang ,  Yong Hui Li ,  Byeong Cheol Moon ,  Yoon Mi Cha ,  Eun Jin Kim

IPC: H01F5/00 ,  H01F17/00 ,  H01F17/04 ,  H01F3/10 ,  H01F27/29 ,  H01F1/14 ,  H01F27/02 ,  H01F27/255 ,  H01F41/04 ,  H01F27/36

Abstract: A coil component includes a body, a coil part embedded in the body, and an insulating layer covering the body. First and second plating electrodes are disposed between the body and the insulating layer, are connected to the coil part, and are disposed to be spaced apart from each other on one surface of the body. First and second through electrodes penetrate through the insulating layer to thereby be connected to the first and second plating electrodes, respectively.

公开(公告)号：US10861651B2

公开(公告)日：2020-12-08

申请号：US16155570

申请日：2018-10-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Ho Lee ,  Duk Hyun Chun ,  Myung Jun Park ,  Eun Jin Kim ,  Hye Min Bang

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/008

Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer, and an external electrode disposed on the body. The external electrode includes a first electrode layer contacting the internal electrode, an oxide layer disposed on the first electrode layer and including a metal oxide and glass, and a second electrode layer disposed on the oxide layer.