Invention Grant
- Patent Title: Image sensor
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Application No.: US16251368Application Date: 2019-01-18
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Publication No.: US11018173B2Publication Date: 2021-05-25
- Inventor: Ji-hwang Kim , Kyung-suk Oh
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2018-0069629 20180618
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor including: a semiconductor substrate having a first region and a second region; an isolation region filling an isolation trench that partially penetrates the semiconductor substrate; a plurality of photoelectric conversion regions defined by the isolation region and forming a first hexagonal array on a plane that is parallel to a surface of the semiconductor substrate; and a plurality of microlenses respectively corresponding to the plurality of photoelectric conversion regions, and forming a second hexagonal array on the plane that is parallel to the surface of the semiconductor substrate.
Public/Granted literature
- US20190386050A1 IMAGE SENSOR Public/Granted day:2019-12-19
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