Invention Grant
- Patent Title: Connector and transmission wafer thereof
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Application No.: US16868542Application Date: 2020-05-07
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Publication No.: US11018455B2Publication Date: 2021-05-25
- Inventor: Kai Wu , Che-Ting Wu , Yueh-Lin Yang , Chung-Nan Pao , Chih-Wei Chen
- Applicant: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
- Applicant Address: CN Suzhou
- Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
- Current Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
- Current Assignee Address: CN Suzhou
- Agent Gang Yu
- Priority: CN201910919090.7 20190926
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R13/6471 ; H01R13/6587 ; H01R13/518 ; H01R12/72 ; H01R12/55 ; H01R12/71

Abstract:
A connector and a transmission wafer thereof are provided. The transmission wafer includes an insulating frame, a plurality of grounding terminals fixed to the insulating frame, and a first shielding member disposed on the insulating frame. At least one of the grounding terminals includes a main segment and a parasitic segment separate from the main segment. The main segment includes a transmission portion fixed in the insulating frame and a tail portion that protrudes from the insulating frame. The parasitic segment includes a fixing portion fixed in the insulating frame and a parasitic contact portion that protrudes from the insulating frame. The first shielding member includes a plurality of first internally connecting arms respectively connected to the grounding terminals, and at least one of the first externally connecting arms is sandwiched between a first edge of the transmission portion and a second edge of the fixing portion.
Public/Granted literature
- US20210098939A1 CONNECTOR AND TRANSMISSION WAFER THEREOF Public/Granted day:2021-04-01
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