Invention Grant
- Patent Title: Glass for semiconductor processing
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Application No.: US17006271Application Date: 2020-08-28
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Publication No.: US11028005B2Publication Date: 2021-06-08
- Inventor: Seiji Inaba , Kazutaka Ono
- Applicant: AGC Inc.
- Applicant Address: JP Tokyo
- Assignee: AGC Inc.
- Current Assignee: AGC Inc.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Main IPC: C03C3/068
- IPC: C03C3/068 ; H01L21/683
Abstract:
To provide a glass plate having a high Young's modulus and a high devitrification viscosity. A glass includes, in mol % based on oxides: SiO2 of 30.0 to 50.0%; B2O3 of 10.0 to 30.0%; Al2O3 of 10.0 to 30.0%; Y2O3 of 3.0 to 17.0%; and Gd2O3 of 3.5 to 17.0%, in which (Gd2O3+Y2O3) is from 16.0 to 22.0%, and (Gd2O3/Y2O3) is from 0.15 to 7.0.
Public/Granted literature
- US20210024402A1 GLASS Public/Granted day:2021-01-28
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