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公开(公告)号:US12017953B2
公开(公告)日:2024-06-25
申请号:US17070035
申请日:2020-10-14
Applicant: AGC Inc.
Inventor: Hirofumi Tokunaga , Kazutaka Ono , Motoyuki Hirose
CPC classification number: C03C3/087 , C03B17/064 , C03C3/091 , C03C4/0085 , C03C2203/10
Abstract: An alkali-free glass has a strain point of 650° C. or more, an average coefficient of thermal expansion at 50 to 350° C. of from 30×10−7 to 45×10−7/° C., and a temperature T2 at which a glass viscosity reaches 102 dPa·s of from 1,500 to 1,800° C. The alkali-free glass contains, as represented by mol % based on oxides, SiO2: from 62 to 70%, Al2O3: from 9 to 16% B2O3: from 0 to 12%, MgO: from 3 to 10%, CaO: from 4 to 12%, SrO: from 0 to 6%, and Fe2O3: from 0.001 to 0.04%, provided that MgO+CaO+SrO+BaO is from 12 to 25%. The alkali-free glass has a β-OH value of from 0.35 to 0.85/mm.
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公开(公告)号:US11897812B2
公开(公告)日:2024-02-13
申请号:US17860443
申请日:2022-07-08
Applicant: AGC Inc.
Inventor: Hirofumi Tokunaga , Kazutaka Ono
CPC classification number: C03C3/087 , C03C3/091 , C03C2201/10 , C03C2203/10
Abstract: An alkali free glass has an average coefficient of thermal expansion at 50 to 350° C. of 30×10−7 to 43×10−7/° C., a Young's modulus of 88 GPa or more, a strain point of 650 to 725° C., a temperature T4 at which a viscosity reaches 104 dPa·s of 1,290° C. or lower, a glass surface devitrification temperature (Tc) of T4+20° C. or lower, and a temperature T2 at which the viscosity reaches 102 dPa·s of 1,680° C. or lower. The alkali free glass contains, as represented by mol % based on oxides, 62 to 67% of SiO2, 12.5 to 16.5% of Al2O3, 0 to 3% of B2O3, 8 to 13% of MgO, 6 to 12% of CaO, 0.5 to 4% of SrO, and 0 to 0.5% of BaO. MgO+CaO+SrO+BaO is 18 to 22%, and MgO/CaO is 0.8 to 1.33.
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公开(公告)号:US11586084B2
公开(公告)日:2023-02-21
申请号:US16454858
申请日:2019-06-27
Applicant: AGC Inc.
Inventor: Kazutaka Ono , Yasumasa Kato , Masaya Kunigita
IPC: B32B15/04 , B32B17/06 , G02F1/1362 , C03C3/091 , C03C17/36 , G02F1/1333 , G02F1/1343 , H01L27/12 , H01L29/423
Abstract: The present invention relates to a liquid crystal display panel having a predetermined size, containing a wiring film formed of a metal, an insulating film containing an inorganic substance and a substrate formed of a non-alkali glass, in which the metal has the product of a Young's modulus (E) and a thermal expansion coefficient (α) at room temperature falling within a predetermined range, α of the inorganic substance is smaller than that of the non-alkali glass, the non-alkali glass has E of from 70 GPa to 95 GPa and α of from 32×10−7 to 45×10−7 (1/° C.) in which E and α satisfies a predetermined formula, and has a predetermined composition.
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公开(公告)号:US11028005B2
公开(公告)日:2021-06-08
申请号:US17006271
申请日:2020-08-28
Applicant: AGC Inc.
Inventor: Seiji Inaba , Kazutaka Ono
IPC: C03C3/068 , H01L21/683
Abstract: To provide a glass plate having a high Young's modulus and a high devitrification viscosity. A glass includes, in mol % based on oxides: SiO2 of 30.0 to 50.0%; B2O3 of 10.0 to 30.0%; Al2O3 of 10.0 to 30.0%; Y2O3 of 3.0 to 17.0%; and Gd2O3 of 3.5 to 17.0%, in which (Gd2O3+Y2O3) is from 16.0 to 22.0%, and (Gd2O3/Y2O3) is from 0.15 to 7.0.
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公开(公告)号:US10759691B2
公开(公告)日:2020-09-01
申请号:US15666862
申请日:2017-08-02
Applicant: AGC Inc.
Inventor: Shuhei Nomura , Kazutaka Ono
IPC: B32B15/04 , B32B17/06 , C03C4/08 , C03C3/085 , C03C3/087 , C03B25/02 , C03C27/00 , B32B9/04 , B32B7/12 , C03C3/091 , C03B17/06 , C03C3/093 , C03C17/25 , G02B5/20 , G02B5/22
Abstract: The present invention provides a glass substrate in which in a heat treatment step of sticking a silicon substrate and a glass substrate to each other, an alkali ion is hardly diffused into the silicon substrate, and a residual strain generated in the silicon substrate is small. A glass substrate of the present invention has: an average thermal expansion coefficient α50/100 at 50° C. to 100° C. of 2.70 ppm/° C. to 3.20 ppm/° C.; an average thermal expansion coefficient α200/300 at 200° C. to 300° C. of 3.45 ppm/° C. to 3.95 ppm/° C.; a value α200/300/α50/100 obtained by dividing the average thermal expansion coefficient α200/300 at 200° C. to 300° C. by the average thermal expansion coefficient α50/100 at 50° C. to 100° C. of 1.20 to 1.30; and a content of an alkali metal oxide being 0% to 0.1% as expressed in terms of a molar percentage based on oxides.
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公开(公告)号:US10386686B2
公开(公告)日:2019-08-20
申请号:US15605235
申请日:2017-05-25
Applicant: AGC Inc.
Inventor: Kazutaka Ono , Yasumasa Kato , Masaya Kunigita
IPC: B32B15/04 , B32B17/06 , G02F1/1362 , C03C3/091 , G02F1/1343 , C03C17/36 , G02F1/1333 , H01L27/12 , H01L29/423
Abstract: The present invention relates to a liquid crystal display panel having a predetermined size, containing a wiring film formed of a metal, an insulating film containing an inorganic substance and a substrate formed of a non-alkali glass, in which the metal has the product of a Young's modulus (E) and a thermal expansion coefficient (α) at room temperature falling within a predetermined range, α of the inorganic substance is smaller than that of the non-alkali glass, the non-alkali glass has E of from 70 GPa to 95 GPa and α of from 32×10−7 to 45×10−7 (1/° C.) in which E and α satisfies a predetermined formula, and has a predetermined composition.
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公开(公告)号:US12234181B2
公开(公告)日:2025-02-25
申请号:US17093121
申请日:2020-11-09
Applicant: AGC Inc.
Inventor: Yusuke Kobayashi , Izuru Kashima , Kazutaka Ono , Seiji Inaba , Hirofumi Yamamoto , Kiyoshi Tamai
Abstract: A supporting glass substrate includes a compression stress layer on a surface thereof, and has an average thermal expansion coefficient at 50° C. to 200° C. that is 7 ppm/° C. to 15 ppm/° C., an internal tensile stress that is 5 MPa to 55 MPa, and a depth of the compression stress layer that is 10 μm to 60 μm.
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公开(公告)号:US12157698B2
公开(公告)日:2024-12-03
申请号:US18157213
申请日:2023-01-20
Applicant: AGC Inc.
Inventor: Shuhei Nomura , Kazutaka Ono
Abstract: Provided is a glass substrate with which it is possible to reduce dielectric loss in high-frequency signals, and which also has excellent thermal shock resistance. This invention satisfies the relation {Young's modulus (GPa)×average thermal expansion coefficient (ppm/° C.) at 50-350° C.}≤300 (GPa·ppm/° C.), wherein the relative dielectric constant at 20° C. and 35 GHz does not exceed 10, and the dielectric dissipation factor at 20° C. and 35 GHz does not exceed 0.006.
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公开(公告)号:US12071370B2
公开(公告)日:2024-08-27
申请号:US17160468
申请日:2021-01-28
Applicant: AGC Inc.
Inventor: Hirofumi Tokunaga , Daisuke Kobayashi , Kazutaka Ono , Atsuyoshi Takenaka , Yoshitaka Maeyanagi
CPC classification number: C03C21/008 , C03C3/087 , C03C3/091 , C03C17/009 , C03C19/00 , G02F1/133512 , C03C2203/10
Abstract: The present invention relates to a glass substrate including a pair of main surfaces and an end surface, and having a surface layer diffusion Sn atom concentration of 2.0×1018 atomic/cm3 or more and 1.4×1019 atomic/cm3 or less in at least one of the main surfaces, the surface layer diffusion Sn atom concentration being obtained by subtracting an Sn atom concentration of an inside of the glass substrate from an Sn atom concentration of a surface layer of the glass substrate, in which the Sn atom concentration of a surface layer of the glass substrate is defined as an Sn atom concentration at a depth of 0.1 to 0.3 μm from the main surface and the Sn atom concentration of an inside of the glass substrate is defined as an Sn atom concentration at a depth of 9.0 to 9.2 μm from the main surface.
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公开(公告)号:US11753330B2
公开(公告)日:2023-09-12
申请号:US17480440
申请日:2021-09-21
Applicant: AGC INC.
Inventor: Yu Hanawa , Kazutaka Ono , Shigeki Sawamura
CPC classification number: C03C3/087 , B32B7/06 , B32B17/06 , H01L21/6835 , H01L21/7813 , B32B2250/02 , B32B2250/03 , B32B2457/14 , C03C3/091 , H01L2221/68318
Abstract: A glass substrate contains, as a glass matrix composition as represented by mole percentage based on oxides, SiO2: 58-75%, Al2O3: 4.5-16%, B2O3: 0-6%, MgO: 0-6%, CaO: 0-6%, SrO: 5-20%, BaO: 5-20%, and MgO+CaO+SrO+BaO:15-40%. The glass substrate has an alkali metal oxide content of 0-0.1% as represented by mole percentage based on oxides. The glass substrate has an average coefficient of thermal expansion α of 56-90 (×10−7/° C.) at 50° C.-350° C.
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