- 专利标题: Electronic component having metal frames with insulating layers thereon
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申请号: US16200373申请日: 2018-11-26
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公开(公告)号: US11037730B2公开(公告)日: 2021-06-15
- 发明人: Ho Yoon Kim , Woo Chul Shin , Sang Soo Park
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR10-2018-0119607 20181008
- 主分类号: H01G4/224
- IPC分类号: H01G4/224 ; H01G4/232 ; H01G4/248 ; H01G4/30 ; H01G4/012 ; H01G4/12 ; H01G4/008
摘要:
An electronic component includes a body; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and first and second metal frames connected to the first and second external electrodes, respectively, wherein the first and second metal frames include first and second support portions bonded to the first and second connection portions, and first and second mounting portions extended in the first direction from lower ends of the first and second support portions and spaced apart from the body and the first and second external electrodes, and further include first and second insulating layers formed on external surfaces of the first and second support portions.
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