Invention Grant
- Patent Title: Method of fabricating array substrate, array substrate and display device
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Application No.: US16486990Application Date: 2018-12-11
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Publication No.: US11043514B2Publication Date: 2021-06-22
- Inventor: Wei Yang , Xinhong Lu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Myers Bigel, P.A.
- Priority: CN201810215915.2 20180315
- International Application: PCT/CN2018/120250 WO 20181211
- International Announcement: WO2019/174333 WO 20190919
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/66 ; H01L29/786 ; H01L27/32

Abstract:
A method of fabricating an array substrate, an array substrate, and a display device is disclosed. The array substrate comprises a display area and a wiring area. The display area is disposed with a first thin film transistor and a second thin film transistor. A distance between a first active layer of the first thin film transistor and a substrate is different from a distance between a second active layer of the second thin film transistor and the substrate. The first thin film transistor comprises first vias that receive a first source/drain. The second thin film transistor includes second vias that receives a second source/drain. The wiring area is provided with a groove. The groove comprises a first sub-groove and a second sub-groove that are stacked. The method includes simultaneously forming the first vias and the first sub-groove, and simultaneously forming the second vias and the second sub-groove.
Information query
IPC分类: