Invention Grant
- Patent Title: Method of testing an interconnection substrate and apparatus for performing the same
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Application No.: US16437675Application Date: 2019-06-11
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Publication No.: US11047901B2Publication Date: 2021-06-29
- Inventor: Mee-Hyun Lim , Sung-Yeol Kim , Seong-Keun Cho , Won-Don Joo , Jae-Hong Kim , Taek-Jin Kim , Kyung-Min Lee , Sang-Min Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2018-0146089 20181123
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01N21/21 ; G01R1/07 ; G01R31/308

Abstract:
In a method of testing an interconnection substrate, a blocking condition of a reference light reflected from a probe having an intrinsic optical characteristic may be set. An electric field emitted from a test interconnection substrate having a plurality of circuits may change the intrinsic optical characteristics of the probe into test optical characteristics. Light may be irradiated to the probe having the test optical characteristics. The reference light reflected from the probe having the test optical characteristic may be blocked in accordance with the blocking condition. The remaining reflected light that may be due to an abnormal circuit may be detected.
Public/Granted literature
- US20200166563A1 METHOD OF TESTING AN INTERCONNECTION SUBSTRATE AND APPARATUS FOR PERFORMING THE SAME Public/Granted day:2020-05-28
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