- 专利标题: Resin-molded capacitor and power conversion device
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申请号: US16254851申请日: 2019-01-23
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公开(公告)号: US11049655B2公开(公告)日: 2021-06-29
- 发明人: Kengo Nishimura , Satoshi Ishibashi , Hidehito Yoshida
- 申请人: Mitsubishi Electric Corporation
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 代理商 Richard C. Turner
- 优先权: JPJP2018-194768 20181016
- 主分类号: H01G4/224
- IPC分类号: H01G4/224 ; H01G4/228 ; H01G4/33 ; H01G4/38 ; H01G4/40 ; H02M7/217 ; H05K7/20 ; H02M7/00
摘要:
The present application provides a resin-molded capacitor such that heat generated by a capacitor element can be efficiently dissipated, and a power conversion device. The resin-molded capacitor includes a first bus bar and a second bus bar joined to a first capacitor electrode and a second capacitor electrode respectively of a capacitor element, an insulating member joined to at least one of the first capacitor electrode and the second capacitor electrode or at least one of the first bus bar and the second bus bar, and an electrically conductive member joined to the insulating member.
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