Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US16833918Application Date: 2020-03-30
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Publication No.: US11049974B2Publication Date: 2021-06-29
- Inventor: Shunpei Yamazaki , Hideomi Suzawa , Tetsuhiro Tanaka , Hirokazu Watanabe , Yuhei Sato , Yasumasa Yamane , Daisuke Matsubayashi
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Fish & Richardson P.C.
- Priority: JP2012-281801 20121225
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/45 ; H01L29/66

Abstract:
A semiconductor device having a reduced amount of oxygen vacancy in a channel formation region of an oxide semiconductor is provided. Further, a semiconductor device which includes an oxide semiconductor and has improved electric characteristics is provided. Furthermore, a methods for manufacturing the semiconductor device is provided. An oxide semiconductor film is formed; a conductive film is formed over the oxide semiconductor film at the same time as forming a low-resistance region between the oxide semiconductor film and the conductive film; the conductive film is processed to form a source electrode and a drain electrode; and oxygen is added to the low-resistance region between the source electrode and the drain electrode, so that a channel formation region having a higher resistance than the low-resistance region is formed and a first low-resistance region and a second low-resistance region between which the channel formation region is positioned are formed.
Public/Granted literature
- US20200227566A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2020-07-16
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