Invention Grant
- Patent Title: Onboarding and accounting of devices into an HPC fabric
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Application No.: US16459082Application Date: 2019-07-01
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Publication No.: US11050751B2Publication Date: 2021-06-29
- Inventor: Ned M. Smith , Barry E. Huntley , Simon Hunt
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H04L29/06
- IPC: H04L29/06 ; H04L29/08

Abstract:
A method to onboard a subordinate node to a high performance computing system that includes a fabric switch network that includes a fabric switch principal and a group of subordinate nodes, wherein the fabric switch principal is configured to route messages between subordinate nodes of the group comprising: receiving a fabric switch principal address message, at an onboarding subordinate node, over an external network; providing an identification message, by the onboarding subordinate node, over the fabric switch network; receiving the identification message, at the fabric switch principal, over the fabric switch network; providing the permission message, by the fabric switch principal, over the fabric switch network; and receiving, a permission message, at the onboarding subordinate node, over the fabric switch network.
Public/Granted literature
- US20190327234A1 ONBOARDING AND ACCOUNTING OF DEVICES INTO AN HPC FABRIC Public/Granted day:2019-10-24
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