Invention Grant
- Patent Title: Image-sensor chip-scale package and method for manufacture
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Application No.: US16600047Application Date: 2019-10-11
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Publication No.: US11056529B2Publication Date: 2021-07-06
- Inventor: Chien-Chan Yeh , Ying-Chih Kuo
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop GPM LLP
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L31/113 ; H01L27/146

Abstract:
A method for fabricating an image-sensor chip-scale package includes bonding, with temporary adhesive, a glass wafer to a device wafer including an array of image sensors. The method also includes forming an isolated-die wafer by removing, from the device wafer, each of a plurality of inter-sensor regions each located between a respective pair of image sensors of the array of image sensors. The isolated-die wafer includes a plurality of image-sensor dies each including a respective image sensor, of the array of image sensors, bonded to the glass wafer. The method also includes encapsulating the isolated-die wafer to form an encapsulated-die wafer; removing, from each of the plurality of image-sensor dies, a respective region of the glass wafer covering the respective image sensor; and singulating the encapsulated-die wafer.
Public/Granted literature
- US20210111221A1 IMAGE-SENSOR CHIP-SCALE PACKAGE AND METHOD FOR MANUFACTURE Public/Granted day:2021-04-15
Information query
IPC分类: