Invention Grant
- Patent Title: Method for manufacturing light emitting module with concave surface light guide plate
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Application No.: US16585810Application Date: 2019-09-27
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Publication No.: US11056615B2Publication Date: 2021-07-06
- Inventor: Daisuke Kasai , Akira Miki , Toru Hashimoto , Shinichi Daikoku
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Hunton Andrews Kurth LLP
- Priority: JPJP2018-185847 20180928,JPJP2018-191219 20181009
- Main IPC: H01L33/24
- IPC: H01L33/24 ; G02F1/13357 ; H01L33/50 ; H01L33/62

Abstract:
In order to obtain a light emitting module with a less unevenness of luminance, provided is a method for manufacturing a light emitting module comprising: preparing a light emitter and a light-transmissive light guide plate, the light emitter comprising a light emitting element, the light guide plate having a first main surface serving as a light emitting surface from which light is emitted outside and a second main surface located opposite to the first main surface and having a concave portion, the concave portion comprising a side surface and a bottom surface that is smaller than an opening of the concave portion in a cross-sectional view; fixing the light emitter to the bottom surface of the concave portion via a bonding member; and forming a wiring at an electrode of the light emitting element.
Information query
IPC分类: