- 专利标题: Resin molded article
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申请号: US16273174申请日: 2019-02-12
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公开(公告)号: US11059944B2公开(公告)日: 2021-07-13
- 发明人: Masayuki Ookoshi , Hiroyuki Moriya , Shigeru Seitoku
- 申请人: FUJIFILM Business Innovation Corp.
- 申请人地址: JP Tokyo
- 专利权人: FUJIFILM Business Innovation Corp.
- 当前专利权人: FUJIFILM Business Innovation Corp.
- 当前专利权人地址: JP Tokyo
- 代理机构: JCIPRNET
- 优先权: JPJP2018-154092 20180820
- 主分类号: C08J5/04
- IPC分类号: C08J5/04 ; C08J5/10 ; C08L23/26 ; B29C70/08
摘要:
A resin molded article includes a first resin formed of a polyolefin, reinforcing fibers, a second resin selected from a group consisting of a resin containing at least one of an amide bond and an imide bond, a resin containing an ester bond, and a resin having a linking group containing a sulfur atom, and a compatibilizer. The absolute value of difference in melting temperature between the first resin and the second resin is 130° C. or lower. At least a portion of the second resin forms domains in the first resin. The domains include first domains that do not contain the reinforcing fibers and second domains that contain the reinforcing fibers and that include a coating layer formed of at least a portion of the second resin on the periphery of the reinforcing fibers. The second domains include a second domain A containing one of the reinforcing fibers and a second domain B containing two or more of the reinforcing fibers.
公开/授权文献
- US20200056000A1 RESIN MOLDED ARTICLE 公开/授权日:2020-02-20
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