Systems or methods of the present disclosure may facilitate meeting connectivity demands between the dies of the modularized integrated circuits. Such an integrated circuit system may include a first die of programmable fabric circuitry that is communicatively coupled to a second die of modular periphery intellectual property (IP) tile via a modular interface. The modular interface may enable communication between a first microbump of the first die and a second microbump of the second die using a time-division multiplexing (TDM) technique. The modular interface may also enable communication between the first microbump and the second microbump using a wire-to-wire connection that does not comprise the TDM technique.