Invention Grant
- Patent Title: Semiconductor chip and semiconductor package including the same
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Application No.: US16455788Application Date: 2019-06-28
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Publication No.: US11075183B2Publication Date: 2021-07-27
- Inventor: Ju-Ik Lee , Dong-Wan Kim , Seokho Shin , Jung-Hoon Han , Sang-Oh Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2018-0078250 20180705
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L25/18 ; H01L23/528 ; H01L23/31 ; H01L23/522

Abstract:
A semiconductor device includes a semiconductor substrate and a connection terminal, including a base pillar, on the semiconductor substrate. An insulation layer is formed on the semiconductor substrate, the insulation layer including an opening in the insulation layer through which the base pillar extends, wherein a side wall of the insulation layer defining the opening includes a horizontal step at a level that is lower than an uppermost portion of the base pillar.
Public/Granted literature
- US20200013745A1 SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Public/Granted day:2020-01-09
Information query
IPC分类: