Invention Grant
- Patent Title: Package structure and assembly structure
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Application No.: US16528319Application Date: 2019-07-31
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Publication No.: US11075188B2Publication Date: 2021-07-27
- Inventor: Wen Hung Huang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/065 ; H01L23/00 ; H01L23/31 ; H01L23/522 ; H01L25/00 ; H01L23/538 ; H01L21/56
Abstract:
A package structure includes a plurality of lower elements, a reinforcement structure and an encapsulant. The lower elements are disposed side by side. The reinforcement structure surrounds the lower elements. The encapsulant covers the lower elements and the reinforcement structure. The electrical connectors of the lower elements are exposed from the encapsulant.
Public/Granted literature
- US20210035949A1 PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-02-04
Information query
IPC分类:
