Invention Grant
- Patent Title: Multilayer ceramic electronic component
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Application No.: US16202053Application Date: 2018-11-27
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Publication No.: US11081281B2Publication Date: 2021-08-03
- Inventor: Sang Roc Lee , Dong Hwi Shin , Sang Soo Park , Woo Chul Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0117400 20181002
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/008

Abstract:
A multilayer ceramic electronic component includes a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween, and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively. The external electrodes include electrode layers electrically connected to the internal electrodes and conductive resin layers disposed on the electrode layers, and the conductive layers are disposed to extend first and second surfaces of the ceramic body. When a distance from an outer edge of one of the first or second external electrodes disposed on a first or second surface to an inner edge thereof is defined as BW and surface roughness of the ceramic body is defined as Ra, a ratio of 100 times the surface roughness Ra to the distance BW (Ra*100/BW) satisfies (Ra*100/BW)≤1.0.
Information query