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公开(公告)号：US11784002B2
公开(公告)日：2023-10-10
申请号：US17389813
申请日：2021-07-30
发明人： Dong Hwi Shin , Dong Yeong Kim , Do Yeon Kim , Woo Chul Shin
CPC分类号： H01G4/2325 , H01G4/012 , H01G4/248 , H01G4/30 , H01G4/1227
摘要： A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes and an external electrode including a connection portion and a band portion. The external electrode includes an electrode layer, a conductive resin layer, a nickel plating layer, and a tin plating layer. When an electrode layer thickness, a conductive resin layer thickness, a nickel plating layer thickness, a tin plating layer thickness of the band portion are defined as t3, t4, and t5, respectively, t5 is greater than or equal to 0.5 micrometer and less than 7 micrometer, and t5/(t3+t4) satisfies 1≤t5/(t3+t4)*100
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公开(公告)号：US11139114B2
公开(公告)日：2021-10-05
申请号：US16525732
申请日：2019-07-30
发明人： Jin Mo Ahn , Sang Roc Lee , Dong Hwi Shin
摘要： A multilayer capacitor includes a body including a stack structure of a plurality of dielectric layers, and a plurality of internal electrodes stacked with the dielectric layers interposed therebetween. A stress alleviation portion is disposed on at least one surface among surfaces of the body, and an external electrode is disposed on an external portion of the body and connected to the internal electrodes. The stress alleviation portion includes a first resin layer adjacent to the body, and a second resin layer covering the first resin layer and including a filler dispersed in a resin of the second resin layer.
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公开(公告)号：US20200075257A1
公开(公告)日：2020-03-05
申请号：US16279070
申请日：2019-02-19
发明人： Je Jung Kim , Do Young Jeong , Dong Hwi Shin , Sang Soo PARK , Woo Chul Shin
摘要： A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrodes including, respectively, electrode layers electrically connected to the internal electrodes, respectively, and conductive resin layers disposed on the electrode layers, respectively.
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公开(公告)号：US11978594B2
公开(公告)日：2024-05-07
申请号：US18135324
申请日：2023-04-17
发明人： In Kyung Jung , Dong Hwi Shin
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayer ceramic electronic component includes a ceramic body, and first and second external electrodes disposed on the surface of the ceramic body, respectively. The ceramic body includes a capacitance forming portion including a dielectric layer and internal electrodes, margin portions disposed on both sides of the capacitance forming portion, and cover portions disposed on both sides of the capacitance forming portion. The first and second external electrodes include first and second base electrodes, respectively, first and second conductive layers disposed on edges of the first and second base electrodes, respectively, and first and second terminal electrodes covering the first and second base electrodes, respectively.
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公开(公告)号：US11763987B2
公开(公告)日：2023-09-19
申请号：US17356110
申请日：2021-06-23
发明人： A Ra Cho , Dong Hwi Shin , Seon Young Yoo
摘要： A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween, and an external electrode disposed on the capacitor body to be connected to the internal electrode. At least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected, and a total number of the at least one intermetallic compound layer is more than or equal to 55% and less than 100% of a total number of the plurality of internal electrodes.
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公开(公告)号：US11101074B2
公开(公告)日：2021-08-24
申请号：US16195181
申请日：2018-11-19
发明人： Dong Hwi Shin , Dong Yeong Kim , Do Yeon Kim , Woo Chul Shin
摘要： A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes and an external electrode including a connection portion and a band portion. The external electrode includes an electrode layer, a conductive resin layer, a nickel plating layer, and a tin plating layer. When an electrode layer thickness, a conductive resin layer thickness, a nickel plating layer thickness, a tin plating layer thickness of the band portion are defined as t3, t4, and t5, respectively, t5 is greater than or equal to 0.5 micrometer and less than 7 micrometer, and t5/(t3+t4) satisfies 1≤t5/(t3+t4)*100
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公开(公告)号：US10395840B1
公开(公告)日：2019-08-27
申请号：US16257642
申请日：2019-01-25
发明人： Chae Min Park , Ki Won Kim , Ji Hee Moon , Dong Hwi Shin , Sang Soo Park , Woo Chul Shin
摘要： A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers disposed to cover the first and second base electrode layers, respectively, and a water repellent layer disposed to cover both external side surfaces of the first and second plating layers and a surface of the ceramic body.
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公开(公告)号：US11657975B2
公开(公告)日：2023-05-23
申请号：US17702230
申请日：2022-03-23
发明人： In Kyung Jung , Dong Hwi Shin
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayer ceramic electronic component includes a ceramic body, and first and second external electrodes disposed on the surface of the ceramic body, respectively. The ceramic body includes a capacitance forming portion including a dielectric layer and internal electrodes, margin portions disposed on both sides of the capacitance forming portion, and cover portions disposed on both sides of the capacitance forming portion. The first and second external electrodes include first and second base electrodes, respectively, first and second conductive layers disposed on edges of the first and second base electrodes, respectively, and first and second terminal electrodes covering the first and second base electrodes, respectively.
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公开(公告)号：US20220208451A1
公开(公告)日：2022-06-30
申请号：US17356110
申请日：2021-06-23
发明人： A Ra Cho , Dong Hwi Shin , Seon Young Yoo
摘要： A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween, and an external electrode disposed on the capacitor body to be connected to the internal electrode. At least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected, and a total number of the at least one intermetallic compound layer is more than or equal to 55% and less than 100% of a total number of the plurality of internal electrodes.
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公开(公告)号：US11315732B2
公开(公告)日：2022-04-26
申请号：US16784461
申请日：2020-02-07
发明人： In Kyung Jung , Dong Hwi Shin
摘要： A multilayer ceramic electronic component includes a ceramic body, and first and second external electrodes disposed on the surface of the ceramic body, respectively. The ceramic body includes a capacitance forming portion including a dielectric layer and internal electrodes, margin portions disposed on both sides of the capacitance forming portion, and cover portions disposed on both sides of the capacitance forming portion. The first and second external electrodes include first and second base electrodes, respectively, first and second conductive layers disposed on edges of the first and second base electrodes, respectively, and first and second terminal electrodes covering the first and second base electrodes, respectively.
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